Finnish-ESA collaboration in ALD nanolaminates for harsh conditions

Picosun Oy, the Finnish provider of advanced Atomic Layer Deposition (ALD) solutions for global industries, has invented an ALD-based method with which the operational lifetime and reliability of printed circuit board assemblies (PCBA) can be efficiently improved. This can be used e.g. in extreme conditions like space.

Metal whisker formation and corrosion are some key factors that cause PCBA performance degradation over time. Metal whiskers are thin filaments or threads growing out from solders, components, and interconnects on the PCBA, and they can cause short-circuiting that leads to a system failure. This is particularly fatal in several sensitive applications such as medical, automotive, space, aviation, military, and industrial control electronics.

Picosun has developed their solution in cooperation with the European Space Agency ESA.

Read the press release (Picosun)

Image: Picosun